JPS6150400B2 - - Google Patents

Info

Publication number
JPS6150400B2
JPS6150400B2 JP56014603A JP1460381A JPS6150400B2 JP S6150400 B2 JPS6150400 B2 JP S6150400B2 JP 56014603 A JP56014603 A JP 56014603A JP 1460381 A JP1460381 A JP 1460381A JP S6150400 B2 JPS6150400 B2 JP S6150400B2
Authority
JP
Japan
Prior art keywords
terminal
printed circuit
circuit board
flexible printed
solder layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56014603A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128995A (en
Inventor
Tadashi Tokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP56014603A priority Critical patent/JPS57128995A/ja
Publication of JPS57128995A publication Critical patent/JPS57128995A/ja
Publication of JPS6150400B2 publication Critical patent/JPS6150400B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
JP56014603A 1981-02-02 1981-02-02 Method of bonding hard printed board to flexible printed board Granted JPS57128995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56014603A JPS57128995A (en) 1981-02-02 1981-02-02 Method of bonding hard printed board to flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56014603A JPS57128995A (en) 1981-02-02 1981-02-02 Method of bonding hard printed board to flexible printed board

Publications (2)

Publication Number Publication Date
JPS57128995A JPS57128995A (en) 1982-08-10
JPS6150400B2 true JPS6150400B2 (en]) 1986-11-04

Family

ID=11865762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56014603A Granted JPS57128995A (en) 1981-02-02 1981-02-02 Method of bonding hard printed board to flexible printed board

Country Status (1)

Country Link
JP (1) JPS57128995A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169483A (ja) * 2000-12-04 2002-06-14 Sony Corp ディスプレイ装置、電子機器およびディスプレイ装置の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61248495A (ja) * 1985-04-25 1986-11-05 日本メクトロン株式会社 可撓性回路基板の接続構造
JP2002050844A (ja) * 2000-08-07 2002-02-15 Mitsumi Electric Co Ltd フレキシブルプリント基板
JP2019033160A (ja) * 2017-08-07 2019-02-28 株式会社小糸製作所 基板および車両用灯具

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844607Y2 (ja) * 1978-03-31 1983-10-08 日本メクトロン株式会社 回路基板相互の接続構造
JPS57106193A (en) * 1980-12-24 1982-07-01 Fujikura Ltd Method of connecting flexible printed circuit to hard board printed circuit and connecting flexible printed circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169483A (ja) * 2000-12-04 2002-06-14 Sony Corp ディスプレイ装置、電子機器およびディスプレイ装置の製造方法

Also Published As

Publication number Publication date
JPS57128995A (en) 1982-08-10

Similar Documents

Publication Publication Date Title
US5786238A (en) Laminated multilayer substrates
US6395993B1 (en) Multilayer flexible wiring boards
TWI733829B (zh) 多層線路板的製造方法
JPS6150400B2 (en])
JPH01319993A (ja) プリント回路基板の接続方法
JPH06104547A (ja) フレキシブル基板
JPS61224494A (ja) プリント基板の接合方法
JP2002290028A (ja) プリント配線基板の接続方法及び接続構造
JPH03145791A (ja) プリント配線板
JPS5844607Y2 (ja) 回路基板相互の接続構造
JPH07106727A (ja) フレキシブル印刷配線板の接続構造
JP2743110B2 (ja) 多層配線板の製造方法
JPS5930555Y2 (ja) プリント基板
JPH0727648Y2 (ja) プリント配線基板
JPS60140896A (ja) 配線基板
JPH0535589B2 (en])
JP2961859B2 (ja) 多層セラミック基板
JPS6364079B2 (en])
JP2699000B2 (ja) 多層プリント基板の電極接続方法
JPH0343724Y2 (en])
JPS6352795B2 (en])
JPH06177533A (ja) 複合プリント基板の接合方法
JPH0491494A (ja) スルーホールプリント配線基板の製造方法
JPH05167242A (ja) フレキシブル回路基板の接合方法
JPH05198936A (ja) ヒートシールコネクタの接続方法